MC7447ATHX1000NB Freescale Semiconductor, MC7447ATHX1000NB Datasheet - Page 27
![IC MPU RISC 1000MHZ 360-FCCBGA](/photos/6/77/67729/mc7447athx1000nb_sml.jpg)
MC7447ATHX1000NB
Manufacturer Part Number
MC7447ATHX1000NB
Description
IC MPU RISC 1000MHZ 360-FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7447AVS733NB.pdf
(56 pages)
Specifications of MC7447ATHX1000NB
Processor Type
MPC74xx PowerPC 32-Bit
Speed
1.0GHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
360-FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC7447ATHX1000NB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
8
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion 12.3 ppm/°C
Package Parameters for the MPC7447A, 360 HCTE BGA
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.72 mm
3.24 mm
0.89 mm (35 mil)
Package Description
27