MC7447AHX1000NB Freescale Semiconductor, MC7447AHX1000NB Datasheet - Page 38

• Manufacturer Part Number: MC7447AHX1000NB
• Description: IC MPU RISC 1000MHZ 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447AHX1000NB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.0GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology (SMT)
capacitors should be used to minimize lead inductance. Orientations where connections are made along
the length of the part, such as 0204, are preferable but not mandatory. Consistent with the
recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic
(Prentice Hall, 1993) and contrary to previous recommendations for decoupling Freescale
microprocessors, multiple small capacitors of equal value are recommended over using multiple values of
capacitance.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the V
capacitors should have a low equivalent series resistance (ESR) rating to ensure the quick response time
necessary. They should also be connected to the power and ground planes through two vias to minimize
inductance. Suggested bulk capacitors are: 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
9.4
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unless otherwise noted, unused active-low inputs should be tied to OV
inputs should be connected to GND. All NC (no connect) signals must remain unconnected.
Power and ground connections must be made to all external V
MPC7447A. For backward compatibility with the MPC7447, MPC7445, and MP7441, or for migrating a
system originally designed for one of these devices to the MPC7447A, the new power and ground signals
(formerly NC, see
with leaving these pins unconnected. However, future devices may require these additional power and
ground signals to be connected to achieve maximum performance, and it is recommended that new designs
include the additional connections to facilitate future upgrades. See also
additional information.
9.5
The MPC7447A processor bus drivers are characterized over process, voltage, and temperature. To
measure Z
resistor is varied until the pad voltage is OV
The output impedance is the average of two components—the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and R
pad equals OV
SW1 is closed (SW2 is open), and R
becomes the resistance of the pull-up devices. R
Then, Z
38
0
= (R
Connection Recommendations
Output Buffer DC Impedance
0
, an external resistor is connected from the chip pad to OV
DD
P
DD
+ R
and OV
/2. R
Table
N
)/2.
N
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
then becomes the resistance of the pull-down devices. When data is held high,
DD
12) may be left unconnected. There is no performance degradation associated
planes, to enable quick recharging of the smaller chip capacitors. These bulk
P
is trimmed until the voltage at the pad equals OV
DD
/2.
P
and R
Figure 18
N
are designed to be close to each other in value.
shows the driver impedance measurement.
DD
, OV
N
DD
DD
is trimmed until the voltage at the
Section 7, “Pinout Listings,”
, and GND pins in the
or GND. The value of each
DD
, and unused active-high
Freescale Semiconductor
DD
/2. R
P
then
for