MC7447AHX1000NB Freescale Semiconductor, MC7447AHX1000NB Datasheet - Page 12

• Manufacturer Part Number: MC7447AHX1000NB
• Description: IC MPU RISC 1000MHZ 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447AHX1000NB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.0GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Electrical and Thermal Characteristics
Table 6
12
At recommended operating conditions. See
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
Notes:
1. Refer to
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
6. This is the thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
the top surface of the board near the package.
Method 1012.1) with the calculated case temperature. The actual value of R
Input high voltage
(all inputs)
Input low voltage
(all inputs)
Input leakage current,
V
V
High-impedance (off-state) leakage current,
V
V
Output high voltage @ I
Output low voltage @ I
in
in
in
in
= OV
= GND
= OV
= GND
provides the DC electrical characteristics for the MPC7447A.
Section 9.8, “Thermal Management Information,”
DD
DD
Characteristic
OL
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
OH
Table 5. Package Thermal Characteristics
= 5 mA
= –5 mA
Characteristic
Table
Table 6. DC Electrical Specifications
4.
Voltage
Nominal
Bus
1.8
2.5
1.8
2.5
1.8
2.5
1.8
2.5
—
—
for details about thermal management.
1
Symbol
V
V
V
I
V
TSI
I
OH
OL
in
IH
IL
OV
OV
θJC
DD
DD
1
–0.3
–0.3
Min
1.7
1.8
for the part is less than 0.1°C/W.
(continued)
—
—
—
—
× 0.65
– 0.45
Symbol
R
R
R
θ
θ
θ
OV
JMA
JC
JB
OV
OV
DD
DD
DD
Max
– 30
– 30
0.45
0.7
0.6
—
—
30
30
× 0.35
+ 0.3
+ 0.3
Value
< 0.1
Freescale Semiconductor
16
10
Unit
µA
µA
V
V
V
V
°C/W
°C/W
°C/W
Unit
Notes
2, 3, 4
2, 6
2, 3
2
Notes
2, 4
5
6