MPC8541EVTAPF Freescale Semiconductor, MPC8541EVTAPF Datasheet - Page 55

• Manufacturer Part Number: MPC8541EVTAPF
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIIr

Specifications of MPC8541EVTAPF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 833MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 833MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 1.14V To 1.26V
• Rohs Compliant: Yes
• Family Name: MPC85XX
• Device Core: PowerQUICC III
• Device Core Size: 32b
• Frequency (max): 833MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 783
• Package Type: FCBGA
• For Use With: MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

14.2
Figure 41
package.
Notes:
Freescale Semiconductor
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All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
The socket lid must always be oriented to A1.
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Mechanical Dimensions of the FC-PBGA
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8541E 783 FC-PBGA
Package and Pin Listings
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