CY7C63723-PC Cypress Semiconductor Corp, CY7C63723-PC Datasheet - Page 46

• Manufacturer Part Number: CY7C63723-PC
• Description: IC MCU 8K LS USB/PS-2 18-DIP
• Manufacturer: Cypress Semiconductor Corp
• Series: enCoRe™r

Specifications of CY7C63723-PC

• Applications: USB Microcontroller
• Core Processor: M8B
• Program Memory Type: OTP (8 kB)
• Controller Series: CY7C637xx
• Ram Size: 256 x 8
• Interface: PS2, USB
• Number Of I /o: 10
• Voltage - Supply: 4 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 18-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 428-1322

28.0
Document #: 38-08022 Rev. *B
0.050[1.270]
TYP.
0.050[1.270]
Package Diagrams
TYP.
12
13
10
9
0.597[15.163]
0.615[15.621]
0.447[11.353]
0.463[11.760]
0.013[0.330]
0.019[0.482]
18 Lead (300 Mil) SOIC - S3
0.013[0.330]
0.019[0.482]
(continued)
FOR
FOR
24
1
18
0.004[0.101]
0.0118[0.299]
1
0.291[7.391]
0.300[7.620]
PIN 1 ID
0.026[0.660]
0.032[0.812]
PIN 1 ID
0.004[0.101]
0.0118[0.299]
0.291[7.391]
0.300[7.620]
18-Lead (300-Mil) Molded SOIC S3
0.092[2.336]
0.105[2.667]
0.026[0.660]
0.032[0.812]
0.092[2.336]
0.105[2.667]
*
0.394[10.007]
0.419[10.642]
24-Lead (300-Mil) SOIC S13
0.394[10.007]
0.419[10.642]
*
SEATING PLANE
SEATING PLANE
*
0.004[0.101]
0.004[0.101]
*
DIMENSIONS IN INCHES[MM]
REFERENCE JEDEC MO-119
DIMENSIONS IN INCHES[MM]
REFERENCE JEDEC MO-119
PACKAGE WEIGHT 0.65gms
0.015[0.381]
0.050[1.270]
0.015[0.381]
0.050[1.270]
S18.3 STANDARD PKG.
SZ18.3 LEAD FREE PKG.
S24.3 STANDARD PKG.
SZ24.3 LEAD FREE PKG.
PART #
PART #
51-85023-A
MIN.
MAX.
MIN.
MAX.
0.0091[0.231]
0.0125[0.317]
CY7C63722
CY7C63723
CY7C63743
0.0091[0.231]
0.0125[0.317]
51-85023-*B
51-85025-*B
Page 46 of 49
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