XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 112

• Manufacturer Part Number: XCV812E-8FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-8FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
Table 5:
Module 4 of 4
36
Bank
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
FG900 Fine-Pitch BGA Package — XCV812E
Description
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
AG27
AK30
AK29
AC29
AH28
AF26
AE25
AD24
AJ30
AJ29
AJ23
AH7
G24
R12
P12
N12
R11
P11
Y18
B30
A30
H29
B29
A29
V28
N28
C28
D27
E26
F25
Pin
M3
F2
P8
www.xilinx.com
1-800-255-7778
Table 5:
Bank
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
FG900 Fine-Pitch BGA Package — XCV812E
Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
DS025-4 (v1.6) July 17, 2002
AC23
AB22
AH18
AB18
AH13
AB13
H23
B23
V22
N22
C18
U17
R17
P17
U16
R16
P16
U15
R15
P15
U14
R14
P14
C13
T17
T16
T15
T14
AJ8
Pin
J18
J13
V9
N9
J9
R