XCV200E-6FG256C Xilinx Inc, XCV200E-6FG256C Datasheet - Page 82
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XCV200E-6FG256C
Manufacturer Part Number
XCV200E-6FG256C
Description
IC FPGA 1.8V C-TEMP 256-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-Er
Datasheet
1.XCV200E-6CS144C.pdf
(233 pages)
Specifications of XCV200E-6FG256C
Number Of Logic Elements/cells
5292
Number Of Labs/clbs
1176
Total Ram Bits
114688
Number Of I /o
176
Number Of Gates
306393
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-BGA
Case
BGA
Dc
02+
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Virtex™-E 1.8 V Field Programmable Gate Arrays
DLL Timing Parameters
All devices are 100 percent functionally tested. Because of the difficulty in directly measuring many internal timing
parameters, those parameters are derived from benchmark timing patterns. The following guidelines reflect worst-case
values across the recommended operating conditions.
Module 3 of 4
22
Input Clock Frequency (CLKDLLHF)
Input Clock Low/High Pulse Width
Input Clock Frequency (CLKDLL)
Description
Output Jitter: the difference between an ideal
reference clock edge and the actual design.
Period Tolerance: the allowed input clock period change in nanoseconds.
Actual Period
Ideal Period
T CLKIN
FCLKINHF
FCLKINLF
Symbol
Figure 4: DLL Timing Waveforms
T
DLLPW
www.xilinx.com
1-800-255-7778
≥ 50 MHz
≥2 5 MHz
≥100 MHz
≥ 150
≥ 200
≥ 250
≥ 300
F
MHz
MHz
MHz
MHz
CLKIN
Phase Offset and Maximum Phase Difference
Min
5.0
3.0
2.4
2.0
1.8
1.5
1.3
60
25
+/- Jitter
+ Maximum
+ Phase Offset
Phase Difference
-8
Max
350
160
T CLKIN + T IPTOL
Speed Grade
ds022_24_091200
Min
_
5.0
3.0
2.4
2.0
1.8
1.5
1.3
60
25
-7
Production Product Specification
DS022-3 (v2.9.2) March 14, 2003
Max
320
160
Min
5.0
3.0
2.4
2.0
1.8
1.5
NA
60
25
-6
Max
275
135
Units
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
R
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