XCV200E-6FG256C Xilinx Inc, XCV200E-6FG256C Datasheet - Page 4
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XCV200E-6FG256C
Manufacturer Part Number
XCV200E-6FG256C
Description
IC FPGA 1.8V C-TEMP 256-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-Er
Datasheet
1.XCV200E-6CS144C.pdf
(233 pages)
Specifications of XCV200E-6FG256C
Number Of Logic Elements/cells
5292
Number Of Labs/clbs
1176
Total Ram Bits
114688
Number Of I /o
176
Number Of Gates
306393
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-BGA
Case
BGA
Dc
02+
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XCV200E-6FG256C
Manufacturer:
XILINX
Quantity:
12 388
Company:
Part Number:
XCV200E-6FG256C
Manufacturer:
XILINX
Quantity:
988
Part Number:
XCV200E-6FG256C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Virtex™-E 1.8 V Field Programmable Gate Arrays
Virtex-E Ordering Information
Revision History
The following table shows the revision history for this document.
Module 1 of 4
4
12/7/99
1/10/00
1/28/00
2/29/00
5/23/00
7/10/00
9/20/00
8/1/00
Date
Version
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Example: XCV300E-6PQ240C
Device Type
Speed Grade
(-6, -7, -8)
•
•
•
•
•
•
•
•
•
•
•
•
Initial Xilinx release.
Re-released with spd.txt v. 1.18, FG860/900/1156 package information, and additional DLL,
Select RAM and SelectI/O information.
Added Delay Measurement Methodology table, updated SelectI/O section, Figures 30, 54,
& 55, text explaining Table 5, T
Measurement notes, notes for Tables 15, 16, and corrected F1156 pinout table footnote
references.
Updated pinout tables, V
Correction to table on p. 22.
Numerous minor edits.
Data sheet upgraded to Preliminary.
Preview -8 numbers added to Virtex-E Electrical Characteristics tables.
Reformatted entire document to follow new style guidelines.
Changed speed grade values in tables on pages 35-37.
Min values added to Virtex-E Electrical Characteristics tables.
XCV2600E and XCV3200E numbers added to Virtex-E Electrical Characteristics
tables (Module 3).
Corrected user I/O count for XCV100E device in Table 1 (Module 1).
Changed several pins to “No Connect in the XCV100E“ and removed duplicate V
pins in Table ~ (Module 4).
Changed pin J10 to “No connect in XCV600E” in Table 74 (Module 4).
Changed pin J30 to “VREF option only in the XCV600E” in Table 74 (Module 4).
Corrected pair 18 in Table 75 (Module 4) to be “AO in the XCV1000E, XCV1600E“.
Figure 1: Ordering Information
www.xilinx.com
1-800-255-7778
CC
page 20, and corrected Figure 20.
BYP
Temperature Range
C = Commercial (Tj = 0 C to +85 C)
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
HQ = High Heat Dissipation
I = Industrial (Tj = -40 C to +100 C)
values, buffered Hex Line info, p. 8, I/O Timing
Revision
DS022_043_072000
Production Product Specification
DS022-1 (v2.3) July 17, 2002
CCINT
R