EPM7256AETI144-7N Altera, EPM7256AETI144-7N Datasheet - Page 15

IC MAX 7000 CPLD 256 144-TQFP

EPM7256AETI144-7N

Manufacturer Part Number
EPM7256AETI144-7N
Description
IC MAX 7000 CPLD 256 144-TQFP
Manufacturer
Altera
Series
MAX® 7000Ar
Datasheet

Specifications of EPM7256AETI144-7N

Programmable Type
In System Programmable
Delay Time Tpd(1) Max
7.5ns
Voltage Supply - Internal
3 V ~ 3.6 V
Number Of Logic Elements/blocks
16
Number Of Macrocells
256
Number Of Gates
5000
Number Of I /o
120
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-TQFP, 144-VQFP
Voltage
3.3V
Memory Type
EEPROM
Number Of Logic Elements/cells
16
Family Name
MAX 7000A
# Macrocells
256
Number Of Usable Gates
5000
Frequency (max)
166.67MHz
Propagation Delay Time
7.5ns
Number Of Logic Blocks/elements
16
# I/os (max)
120
Operating Supply Voltage (typ)
3.3V
In System Programmable
Yes
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2063
EPM7256AETI144-7N

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Altera Corporation
SameFrame
Pin-Outs
MAX 7000A devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPM7128AE device in a 100-pin
FineLine BGA package to an EPM7512AE device in a 256-pin
FineLine BGA package.
The Altera design software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The software generates pin-outs describing how to lay out a board to
take advantage of this migration (see
Figure 7. SameFrame Pin-Out Example
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
Designed for 256-Pin FineLine BGA Package
FineLine
100-Pin
BGA
MAX 7000A Programmable Logic Device Data Sheet
Printed Circuit Board
Figure
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
7).
FineLine
256-Pin
BGA
15

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