GCM32DR72A225KA64L Murata Electronics, GCM32DR72A225KA64L Datasheet - Page 46

• Manufacturer Part Number: GCM32DR72A225KA64L
• Manufacturer: Murata Electronics

2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
1. Construction of Board Pattern
Construction and Dimensions of Pattern (Example)
Land Layout to Prevent Excessive Solder
!Note
44
Notice
Examples of
Prohibition
Examples of
Improvements
by the Land
Division
Solder and Mounting
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Capacitor
Preparing slit helps flux
cleaning and resin coating on
the back of the capacitor.
c
b
d
a
e
Solder Resist
Mounting Close to a Chassis
Slit
d
d
1
Chassis
2
Solder Resist
Land
Land Pattern
Base board
Solder (Ground solder)
d
1
<d
Adhesive
2
L
in section
in section
W
Flow Soldering
Flow soldering : 3.2g1.6 or less available.
Reflow Soldering
3.2g1.6
3.2g2.5
2.0g1.25
3.2g1.6
2.0g1.25
Mounting with Leaded Components
LgW
LgW
Solder Resist
1.0-1.2
2.2-2.6
1.0-1.2
2.2-2.4
2.0-2.4
a
a
Lead Wire Connected
to a Part Provided
with Lead Wires.
0.9-1.0
1.0-1.1
0.6-0.7
0.8-0.9
1.0-1.2
in section
in section
b
b
0.8-1.1
1.0-1.4
0.8-1.1
1.0-1.4
1.8-2.3
c
c
Mounting Leaded Components Later
Continued on the following page.
Solder Resist
1.0-2.0
1.0-2.0
d
-
3.2-3.7
4.1-4.6
Soldering Iron
Lead Wire of
Component to be
Connected Later.
(in mm)
e
-
in section
in section
C03E.pdf
09.3.31