GCM32DR72A225KA64L Murata Electronics, GCM32DR72A225KA64L Datasheet - Page 24

• Manufacturer Part Number: GCM32DR72A225KA64L
• Manufacturer: Murata Electronics

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Mounting Position
2. Chip Placing
22
!Caution
!Caution
!Caution (Soldering and Mounting)
An excessively low bottom dead point of the suction
Dirt particles and dust accumulated between the suction
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction bottom dead point must be set on
the upper surface of the board. Nozzle pressure for chip
mounting must be a 1 to 3N static load.
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
[Component direction]
[Chip Mounting Close to Board Separation Point]
[Incorrect]
[Correct]
Perforation
Suction Nozzle
A
Board
Slit
B
Support Pin
D
C
Deflection
Continued on the following page.
Locate chip
horizontal to the
direction in which
stress acts.
Chip arrangement
Worst A-C- (B, D)
Best
Board Guide
C03E.pdf
09.3.31