MT47H32M8BP-3:B Micron Technology Inc, MT47H32M8BP-3:B Datasheet - Page 3

MT47H32M8BP-3:B

Manufacturer Part Number
MT47H32M8BP-3:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H32M8BP-3:B

Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
190mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H32M8BP-3:B
Manufacturer:
MICRON
Quantity:
586
Part Number:
MT47H32M8BP-3:B TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 26
AC and DC Operating Conditions .................................................................................................................... 37
ODT DC Electrical Characteristics ................................................................................................................... 38
Input Electrical Characteristics and Operating Conditions ............................................................................... 39
Output Electrical Characteristics and Operating Conditions ............................................................................. 42
Output Driver Characteristics ......................................................................................................................... 44
Power and Ground Clamp Characteristics ....................................................................................................... 48
AC Overshoot/Undershoot Specification ......................................................................................................... 49
Input Slew Rate Derating ................................................................................................................................ 51
Commands .................................................................................................................................................... 64
Mode Register (MR) ........................................................................................................................................ 70
Extended Mode Register (EMR) ....................................................................................................................... 75
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Industrial Temperature ................................................................................................................................ 9
Automotive Temperature ........................................................................................................................... 10
General Notes ............................................................................................................................................ 10
Package Dimensions .................................................................................................................................. 17
FBGA Package Capacitance ......................................................................................................................... 19
Temperature and Thermal Impedance ........................................................................................................ 20
I
I
Truth Tables ............................................................................................................................................... 64
DESELECT ................................................................................................................................................. 68
NO OPERATION (NOP) .............................................................................................................................. 69
LOAD MODE (LM) ..................................................................................................................................... 69
ACTIVATE .................................................................................................................................................. 69
READ ......................................................................................................................................................... 69
WRITE ....................................................................................................................................................... 69
PRECHARGE .............................................................................................................................................. 70
REFRESH ................................................................................................................................................... 70
SELF REFRESH ........................................................................................................................................... 70
Burst Length .............................................................................................................................................. 71
Burst Type ................................................................................................................................................. 72
Operating Mode ......................................................................................................................................... 72
DLL RESET ................................................................................................................................................. 72
Write Recovery ........................................................................................................................................... 73
Power-Down Mode .................................................................................................................................... 73
CAS Latency (CL) ........................................................................................................................................ 74
DLL Enable/Disable ................................................................................................................................... 76
Output Drive Strength ................................................................................................................................ 76
DQS# Enable/Disable ................................................................................................................................. 76
RDQS Enable/Disable ................................................................................................................................. 76
Output Enable/Disable ............................................................................................................................... 76
On-Die Termination (ODT) ........................................................................................................................ 77
DD
DD7
Specifications and Conditions ............................................................................................................... 23
Conditions .......................................................................................................................................... 23
DD
Parameters ........................................................................................................ 23
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
©2003 Micron Technology, Inc. All rights reserved.

Related parts for MT47H32M8BP-3:B