MT47H32M8BP-3:B Micron Technology Inc, MT47H32M8BP-3:B Datasheet - Page 2

• Manufacturer Part Number: MT47H32M8BP-3:B
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M8BP-3:B

• Organization: 32Mx8
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 190mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Table 2: Addressing
Figure 1: 256Mb DDR2 Part Numbers
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Configuration
64 Meg x 4
32 Meg x 8
16 Meg x 16
Note:
Package
Pb-free
84-ball 8mm x 14mm FBGA
60-ball 8mm x 12mm FBGA
Lead solder
84-ball 8mm x 14mm FBGA
60-ball 8mm x 12mm FBGA
MT47H
1. Not all speeds and configurations are available in all packages.
16M16
64M4
32M8
Example Part Number: MT47H32M8BP-3 :B
Configuration
16 Meg x 4 x 4 banks
A[11, 9:0] (2K)
Package
64 Meg x 4
A[12:0] (8K)
BA[1:0] (4)
BG
BP
FG
FP
8K
-
Speed
-37E
-5E
-3
Speed Grade
t CK = 3ns, CL = 5
t CK = 3.75ns, CL = 4
t CK = 5ns, CL = 3
AT
IT
L
Low power
Industrial temperature
Automotive temperature
Revision
:B
2
:
Revision
8 Meg x 8 x 4 banks
32 Meg x 8
A[12:0] (8K)
A[9:0] (1K)
BA[1:0] (4)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
8K
256Mb: x4, x8, x16 DDR2 SDRAM
©2003 Micron Technology, Inc. All rights reserved.
4 Meg x 16 x 4 banks
16 Meg x 16
A[12:0] (8K)
A[8:0] (512)
BA[1:0] (4)
8K
Features