AD5601BKSZ-500RL7 Analog Devices Inc, AD5601BKSZ-500RL7 Datasheet - Page 19

• Manufacturer Part Number: AD5601BKSZ-500RL7
• Description: IC DAC 8BIT BUFF V-OUT SC70-6
• Manufacturer: Analog Devices Inc
• Series: nanoDAC™r

Specifications of AD5601BKSZ-500RL7

• Data Interface: Serial
• Settling Time: 6µs
• Number Of Bits: 8
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 500µW
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-6, SC-88, SOT-363
• Resolution (bits): 8bit
• Sampling Rate: 1.7MSPS
• Input Channel Type: Serial
• Supply Voltage Range - Analog: 2.7V To 5.5V
• Supply Current: 75µA
• Digital Ic Case Style: SC-70
• Number Of Channels: 1
• Resolution: 8b
• Conversion Rate: 1.7MSPS
• Interface Type: SER 3W SPI QSPI UW
• Single Supply Voltage (typ): 3.3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Architecture: Resistor-String
• Power Supply Requirement: Single
• Output Type: Voltage
• Integral Nonlinearity Error: ±0.5+/- LSB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 6
• Package Type: SC-70
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

USING THE AD5601/AD5611/AD5621 WITH A
GALVANICALLY ISOLATED INTERFACE
In process control applications in industrial environments,
it is often necessary to use a galvanically isolated interface to
protect and isolate the controlling circuitry from any hazardous
common-mode voltages that might occur in the area where the
DAC is functioning. iCoupler® provides isolation in excess of
2.5 kV. Because the AD5601/AD5611/AD5621 use a 3-wire serial
logic interface, the
provides the required isolation (see Figure 52). The power
supply to the part also needs to be isolated, which is done by
using a transformer. On the DAC side of the transformer, a 5 V
regulator provides the 5 V supply required for the AD5601/
AD5611/AD5621.
Figure 52. AD5601/AD5611/AD5621 with a Galvanically Isolated Interface
SCLK
DATA
SDI
POWER
V
V
V
IA
IB
IC
ADuM1300
ADuM1300
V
V
V
REGULATOR
OA
OB
OC
5V
3-channel digital isolator
SCLK
SYNC
SDIN
AD5601/
AD5611/
AD5621
GND
V
DD
V
10µF
OUT
0.1µF
Rev. E | Page 19 of 20
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The PCB containing the AD5601/AD5611/AD5621
should have separate analog and digital sections, each having its
own area of the board. If the AD5601/AD5611/AD5621 are in a
system where other devices require an AGND-to-DGND
connection, the connection should be made at one point only.
This ground point should be as close as possible to the
AD5601/AD5611/AD5621.
The power supply to the AD5601/AD5611/AD5621 should be
bypassed with 10 μF and 0.1 μF capacitors. The capacitors
should be physically as close as possible to the device, with the
0.1 μF capacitor ideally right up against the device. The 10 μF
capacitors are the tantalum bead type. It is important that the
0.1 μF capacitor have low effective series resistance (ESR) and
effective series inductance (ESI), such as in common ceramic
types of capacitors. This 0.1 μF capacitor provides a low imped-
ance path to ground for high frequencies caused by transient
currents due to internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects on the board. The best board layout tech-
nique is the microstrip technique, where the component side of
the board is dedicated to the ground plane only and the signal
traces are placed on the solder side. However, this is not always
possible with a two-layer board.
AD5601/AD5611/AD5621