148384-5 TE Connectivity, 148384-5 Datasheet - Page 13

• Manufacturer Part Number: 148384-5
• Description: SOCKET, DIN41612, STRAIGHT, M, 24+8WAY
• Manufacturer: TE Connectivity

Specifications of 148384-5

• Connector Type: Pitch Spacing
• No. Of Contacts: 32
• Gender: Receptacle
• No. Of Rows: 3
• Rows Loaded: A + B + C
• Contact Termination: Through Hole
• Contact Material: Phosphor Bronze
• Contact: RoHS Compliant
• Pitch Spacing: 2.54mm
• Contact Plating: Gold
• Rohs Compliant: Yes
• Product Series: Type M
• Mount Angle: Vertical
• Post Type: Compliant Post
• Din Level: II
• Loaded With Single Contacts Only: Yes
• Color: Gray
• Toolless (flat Rock): Yes
• Termination Post Length (mm [in]): 6.00 [0.236]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Signal Contacts: 24
• Contact Type: Socket
• Number Of Power Or Coaxial Contacts: 8
• Preloaded: Yes
• Contact Configuration: Coaxial, Power
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold Flash over Palladium Nickel
• Connector Style: Receptacle
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Pcb Thickness, Recommended (mm [in]): 1.57 [0.062]
• Application: Board-to-Board Power

3.8. Soldering
Connectors with solder contacts can be mounted on and secured to a pc board by hand soldering or wave
soldering techniques.
ALPHA, BIOACT, CARBITOL, KESTER, and LONCOTERGE are trademarks of their respective owners.
Rev G
CAUTION
C. Mating Conditions
To ensure reliable connections and prevent unnecessary damage to connectors, refer to the
recommended vertical alignment and offset tolerances shown in Figure 11.
A. Flux Selection
Solder tines and pc board attaching hardware must be fluxed prior to soldering. Selection of the flux will
depend on the type of pc board used and other components that may be mounted on the board. Also, the
choice will have to be compatible with the wave solder line, manufacturing, and safety requirements.
B. Cleaning
Fluxes, residues, and activators must be removed. Cleaning procedures depend on the type of flux used
on the solder line. The following cleaning compounds and chemicals may be used to clean the connectors
without adverse affect on the housings and contacts. See Figure 12.
!
ALPHA 2110
BIOACT EC--7
Butyl CARBITOL
Isopropyl Alcohol
KESTER 5778
KESTER 5779
LONCOTERGE 520
LONCOTERGE 530
Terpene Solvent
DISCONNECT electrical current before mating or unmating connectors.
1.02 [.040]
NAME
Vertical Alignment
CLEANER
1.02 [.040]
Aqueous
Aqueous
Aqueous
Aqueous
Aqueous
Solvent
Solvent
Solvent
Solvent
TYPE
Figure 11
Figure 12
(Minutes)
TIME
TIME
1
5
1
5
5
5
5
5
5
+4_
Offset Tolerances
TEMPERATURE
TEMPERATURE
132_C [270_F]
100_C [212_F]
100_C [212_F]
100_C [212_F]
100_C [212_F]
100_C [212_F]
100_C [212_F]
100_C [212_F]
Ambient Room
(Maximum)
+2_
114- 9014
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