PCF8591P,112 NXP Semiconductors, PCF8591P,112 Datasheet - Page 23

• Manufacturer Part Number: PCF8591P,112
• Description: IC ADC/DAC 8-BIT I2C 16-DIP
• Manufacturer: NXP Semiconductors
• Type: ADC, DACr

Specifications of PCF8591P,112

• Package / Case: 16-DIP (0.300", 7.62mm)
• Resolution (bits): 8 b
• Sampling Rate (per Second): 11.1k
• Data Interface: I²C, Serial
• Voltage Supply Source: Dual ±
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Resolution: 8 bit
• Interface Type: I2C
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2.5 V
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1087-5; 933768130112; PCF8591PN

Philips Semiconductors
17 SOLDERING
17.1
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
17.2
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
17.4
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2003 Jan 27
DBS, DIP, HDIP, SDIP, SIL
8-bit A/D and D/A converter
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Suitability of through-hole mount IC packages for dipping and wave soldering methods
PACKAGE
suitable
DIPPING
23
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
17.3
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
SOLDERING METHOD
Manual soldering
suitable
(1)
WAVE
Product specification
PCF8591
stg(max)
). If the