MAX1091BEEI+ Maxim Integrated Products, MAX1091BEEI+ Datasheet - Page 8

• Manufacturer Part Number: MAX1091BEEI+
• Description: IC ADC 10BIT 250KSPS 28-QSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX1091BEEI+

• Number Of Bits: 10
• Sampling Rate (per Second): 250k
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 667mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-QSOP
• Number Of Adc Inputs: 8
• Architecture: SAR
• Conversion Rate: 250 KSPs
• Resolution: 10 bit
• Input Type: Differential
• Interface Type: Parallel
• Voltage Reference: Internal 2.5 V or External
• Supply Voltage (max): 3 V
• Maximum Power Dissipation: 762 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

250ksps, +3V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
8
MAX1091
_______________________________________________________________________________________
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
PIN
MAX1093
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
—
—
—
—
1
2
3
4
5
6
7
8
9
REFADJ
V
NAME
D1/D9
D0/D8
HBEN
COM
GND
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
LOGIC
CLK
REF
V
INT
WR
RD
D7
D6
D5
D4
D3
D2
CS
DD
High Byte Enable. Used to multiplex the 10-bit conversion result.
1: 2 MSBs are multiplexed on the data bus.
0: 8 LSBs are available on the data bus.
Three-State Digital I/O Line (D7)
Three-State Digital I/O Line (D6)
Three-State Digital I/O Line (D5)
Three-State Digital I/O Line (D4)
Three-State Digital I/O Line (D3)
Three-State Digital I/O Line (D2)
Three-State Digital I/O Line (D1, HBEN = 0; D9, HBEN = 1)
Three-State Digital I/O Line (D0, HBEN = 0; D8, HBEN = 1)
INT goes low when the conversion is complete and the output data is ready.
Active-Low Read Select. If CS is low, a falling edge on RD enables the read operation on
the data bus.
Active-Low Write Select. When CS is low in internal acquisition mode, a rising edge on WR
latches in configuration data and starts an acquisition plus a conversion cycle. When CS is
low in external acquisition mode, the first rising edge on WR ends acquisition and starts a
conversion.
Clock Input. In external clock mode, drive CLK with a TTL/CMOS-compatible clock. In
internal clock mode, connect this pin to either V
Active-Low Chip Select. When CS is high, digital outputs (INT, D7–D0) are high imped-
ance.
Analog Input Channel 7
Analog Input Channel 6
Analog Input Channel 5
Analog Input Channel 4
Analog Input Channel 3
Analog Input Channel 2
Analog Input Channel 1
Analog Input Channel 0
Ground Reference for Analog Inputs. Sets zero-code voltage in single-ended mode and
must be stable to ±0.5 LSB during conversion.
Analog and Digital Ground
Bandgap Reference Output/Bandgap Reference Buffer Input. Bypass to GND with a
0.01µF capacitor. When using an external reference, connect REFADJ to V
the internal bandgap reference.
Bandgap Reference Buffer Output/External Reference Input. Add a 4.7µF capacitor to
GND when using the internal reference.
Analog +5V Power Supply. Bypass with a 0.1µF capacitor to GND.
Digital Power Supply. V
range from +1.8V to V
DD
LOGIC
+ 300mV.
powers the digital outputs of the data converter and can
FUNCTION
DD
or GND.
Pin Description
DD
to disable