MAX1091BEEI+ Maxim Integrated Products, MAX1091BEEI+ Datasheet - Page 8
![IC ADC 10BIT 250KSPS 28-QSOP](/photos/6/61/66154/28-qsop_21-0055_sml.jpg)
MAX1091BEEI+
Manufacturer Part Number
MAX1091BEEI+
Description
IC ADC 10BIT 250KSPS 28-QSOP
Manufacturer
Maxim Integrated Products
Datasheet
1.MAX1093BEEG.pdf
(20 pages)
Specifications of MAX1091BEEI+
Number Of Bits
10
Sampling Rate (per Second)
250k
Data Interface
Parallel
Number Of Converters
1
Power Dissipation (max)
667mW
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-QSOP
Number Of Adc Inputs
8
Architecture
SAR
Conversion Rate
250 KSPs
Resolution
10 bit
Input Type
Differential
Interface Type
Parallel
Voltage Reference
Internal 2.5 V or External
Supply Voltage (max)
3 V
Maximum Power Dissipation
762 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
250ksps, +3V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
8
MAX1091
_______________________________________________________________________________________
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
PIN
MAX1093
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
—
—
—
—
1
2
3
4
5
6
7
8
9
REFADJ
V
NAME
D1/D9
D0/D8
HBEN
COM
GND
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
LOGIC
CLK
REF
V
INT
WR
RD
D7
D6
D5
D4
D3
D2
CS
DD
High Byte Enable. Used to multiplex the 10-bit conversion result.
1: 2 MSBs are multiplexed on the data bus.
0: 8 LSBs are available on the data bus.
Three-State Digital I/O Line (D7)
Three-State Digital I/O Line (D6)
Three-State Digital I/O Line (D5)
Three-State Digital I/O Line (D4)
Three-State Digital I/O Line (D3)
Three-State Digital I/O Line (D2)
Three-State Digital I/O Line (D1, HBEN = 0; D9, HBEN = 1)
Three-State Digital I/O Line (D0, HBEN = 0; D8, HBEN = 1)
INT goes low when the conversion is complete and the output data is ready.
Active-Low Read Select. If CS is low, a falling edge on RD enables the read operation on
the data bus.
Active-Low Write Select. When CS is low in internal acquisition mode, a rising edge on WR
latches in configuration data and starts an acquisition plus a conversion cycle. When CS is
low in external acquisition mode, the first rising edge on WR ends acquisition and starts a
conversion.
Clock Input. In external clock mode, drive CLK with a TTL/CMOS-compatible clock. In
internal clock mode, connect this pin to either V
Active-Low Chip Select. When CS is high, digital outputs (INT, D7–D0) are high imped-
ance.
Analog Input Channel 7
Analog Input Channel 6
Analog Input Channel 5
Analog Input Channel 4
Analog Input Channel 3
Analog Input Channel 2
Analog Input Channel 1
Analog Input Channel 0
Ground Reference for Analog Inputs. Sets zero-code voltage in single-ended mode and
must be stable to ±0.5 LSB during conversion.
Analog and Digital Ground
Bandgap Reference Output/Bandgap Reference Buffer Input. Bypass to GND with a
0.01µF capacitor. When using an external reference, connect REFADJ to V
the internal bandgap reference.
Bandgap Reference Buffer Output/External Reference Input. Add a 4.7µF capacitor to
GND when using the internal reference.
Analog +5V Power Supply. Bypass with a 0.1µF capacitor to GND.
Digital Power Supply. V
range from +1.8V to V
DD
LOGIC
+ 300mV.
powers the digital outputs of the data converter and can
FUNCTION
DD
or GND.
Pin Description
DD
to disable