AD9233BCPZ-125 Analog Devices Inc, AD9233BCPZ-125 Datasheet - Page 8

• Manufacturer Part Number: AD9233BCPZ-125
• Description: IC ADC 12BIT 80/105/125 48-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9233BCPZ-125

• Data Interface: Serial, SPI™
• Number Of Bits: 12
• Sampling Rate (per Second): 125M
• Number Of Converters: 3
• Power Dissipation (max): 425mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN, CSP Exposed Pad
• Resolution (bits): 12bit
• Sampling Rate: 125MSPS
• Input Channel Type: Differential, Single Ended
• Supply Voltage Range - Analog: 1.7V To 1.9V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9233-125EBZ - BOARD EVALUATION FOR AD9233
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9233
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
ENVIRONMENTAL
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0 through D11 to DRGND
DCO to DRGND
OR to DRGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
VREF to AGND
SENSE to AGND
REFT to AGND
REFB to AGND
SDIO/DCS to DRGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
OEB to AGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
(Soldering 10 Sec)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 1.3 V
−0.3 V to AVDD + 1.3 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
–65°C to +125°C
–40°C to +85°C
300°C
150°C
Rev. A | Page 8 of 44
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
48-lead LFCSP (CP-48-3)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes,
reduces the θ
JA
and θ
JA
.
JC
are specified for a 4-layer board in still air.
θ
26.4
JA
θ
2.4
JC
Unit
°C/W
JA
. In