ISL12020MIRZ Intersil, ISL12020MIRZ Datasheet - Page 30

• Manufacturer Part Number: ISL12020MIRZ
• Description: IC RTC/CALENDAR TEMP SNSR 20-DFN
• Manufacturer: Intersil
• Type: Clock/Calendarr

Specifications of ISL12020MIRZ

• Memory Size: 1K (128 x 8)
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
10/22/09
07/24/09
06/22/09
2/11/10
DATE
REVISION
FN6667.4
FN6667.4
FN6667.3
FN6667.3
30
Updated Note 2 in Ordering Information table from “These Intersil Pb-free plastic packaged
products employ special Pb-free material sets, molding compounds/die attach materials, and
100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and
compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.” to “These Intersil plastic packaged products employ special material
sets, molding compounds and 100% matte tin plate plus anneal (e3) termination finish. These
products do contain Pb but they are RoHS compliant by exemption 7 (lead in high melt temp
solder for internal connections) and exemption 5 (lead in piezoelectric elements). These Intersil
RoHS compliant products are compatible with both SnPb and Pb-free soldering operations. These
Intersil RoHS compliant products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.”
Changed "Pb-Free" on page 1 and page 3 under package to: "RoHS Compliant"
Converted to New Intersil Template - Matched front page to match ISL12022M with the
exception of pinout change from SOIC to DFN. Updated ordering information by numbering all
notes, setting up links, added MSL (Moisture Sensitivity Level) note. Updated word "Pinout" to
"Pin Configuration". Pin Descriptions updated by adding descriptive text taken from page 9.
Deleted Text Pin Descriptions that were on page 9. Changed Thermal information from "Tja
85, Tjc 3" To "Tja 40, Tjc 3.5" to match ASYD in Intrepid. Pb-free reflow link now shown in
blue. Updated Notes in Electrical Spec Table to follow flow of numbers when referenced. Added
"boldface limits..." text in Electrical Spec Conditions to indicate Min and Max over-temp.
Bolded all over-temp Min and Max values. Added Revision History and Products information
with links. Updated POD from Rev0 to Rev1 to match Intrepid. Added Table of Contents.
Page 1: in the Features section, corrected typo in the second bullet from:
20 Ld DFN Package (for SOIC package see ISL12020M)
To:20 Ld DFN Package (for SOIC package see ISL12022M)
No rev, no date change, no formal review necessary
Changes in Word document attached in Intrepid.
http://intranet.intrepid.intersil.com/Windchill/servlet/WindchillAuthGW/wt.content.ContentHt
tp/viewContent/12020M.doc?u8&HttpOperationItem=wt.content.ApplicationData%3A120896
672&ContentHolder=ext.isil.part.mcol.MCOL%3A120896665
ISL12020M
CHANGE
February 11, 2010
FN6667.4