SY89534LHC Micrel Inc, SY89534LHC Datasheet - Page 4

IC SYNTHESIZR LVPECL/LVDS 64TQFP

SY89534LHC

Manufacturer Part Number
SY89534LHC
Description
IC SYNTHESIZR LVPECL/LVDS 64TQFP
Manufacturer
Micrel Inc
Series
Precision Edge®r
Type
Clock/Frequency Synthesizerr
Datasheet

Specifications of SY89534LHC

Pll
Yes with Bypass
Input
CMOS, HSTL, LVDS, LVPECL, LVTTL, SSTL
Output
LVPECL
Number Of Circuits
1
Ratio - Input:output
1:13
Differential - Input:output
Yes/Yes
Frequency - Max
500MHz
Divider/multiplier
Yes/No
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
Frequency-max
500MHz
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SY89534LHC
Manufacturer:
Micrel Inc
Quantity:
10 000
Micrel, Inc.
Power Supply
LVCMOS/LVTTL Input Control Logic (All V
NOTES:
1. permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
2. It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.
3. V
4. No load. Outputs floating, Banks A, B, and C enabled.
M9999-110308
hbwhelp@micrel.com or (408) 955-1690
Symbol
V
V
V
V
I
Symbol
V
V
I
I
CC
IH
IL
ABSOLUTE MAXIMUM RATINGS
All V
V
I
T
T
DC ELECTRICAL CHARACTERISTICS
CCA
CC_LOGIC
CCO
CCO
IH
IL
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
OUT
JA
JC
LEAD
store
CCA
IN
(3)
A/C
B
CC
, V
Symbol
CC_LOGIC
PLL and Logic Supply Voltage
Bank A and C V
Bank B V
Total Supply Current
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
, V
CCO
Parameter
CC
Parameter
A/C. V
V
Input Voltage
DC Output Current
Lead Temperature (soldering, 20sec.)
Storage Temperature
Package Thermal Resistance (Junction-to-Ambient)
With Die attach soldered to GND:
With Die attach NOT soldered to GND:
Package Thermal Resistance
(Junction-to-Case)
Output
CC
SY89534L PECL
SY89535L LVDS
CC
LVPECL/LVDS
Pin Potential to Ground Pin
CCO
Output
B are not internally connected together inside the device. They must be connected together on the PCB.
(4)
Min.
Min.
(1)
3.0
3.0
3.0
2.0
CC
pins = +3.3V 10%)
Rating
T
T
A
A
Typ.
Typ.
275
= 0 C
3.3
3.3
3.3
= 0 C
(2)
Max.
Max.
4
260
330
3.6
3.6
3.6
0.8
–LVPECL outputs
–200lfpm (TQFP)
–500lfpm (TQFP)
–200lfpm (TQFP)
–500lfpm (TQFP)
–Still-Air (TQFP)
–Still-Air (TQFP)
–LVDS outputs
–300
Min.
Min.
3.0
3.0
3.0
2.0
T
T
A
A
= +25 C
= +25 C
Typ.
Typ.
285
3.3
3.3
3.3
–0.5 to +4.0
–0.5 to V
–65 to +150
Max.
Max.
260
330
150
3.6
3.6
3.6
0.8
Value
–50
260
4.4
23
18
15
44
36
30
10
CCI
Min.
Min.
3.0
3.0
3.0
2.0
T
T
A
A
= +85 C
= +85 C
Typ.
Typ.
300
3.3
3.3
3.3
Precision Edge
Max.
Max.
260
330
SY89534/35L
Unit
3.6
3.6
3.6
0.8
C/W
C/W
C/W
C/W
C/W
C/W
C/W
mA
mA
V
V
C
C
Unit
Unit
mA
mA
V
V
V
V
V
A
A
®

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