SY58605UMG TR Micrel Inc, SY58605UMG TR Datasheet - Page 3

• Manufacturer Part Number: SY58605UMG TR
• Description: IC BUFFER LVDS 3.2GBPS FSI 8-MLF
• Manufacturer: Micrel Inc
• Series: Precision Edge®r
• Type: Buffer/Driverr

Specifications of SY58605UMG TR

• Number Of Circuits: 1
• Ratio - Input:output: 1:1
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MLF®, QFN
• Frequency-max: 3GHz
• Number Of Outputs: 2
• Operating Supply Voltage (max): 2.625V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.42ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Supply Voltage (typ): 2.5V
• Package Type: MLF
• Input Frequency: 3GHz
• Duty Cycle: 53%
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant
• Other names: 576-1596-2

Micrel, Inc.
Absolute Maximum Ratings
Supply Voltage (V
Input Voltage (V
LVDS Output Current (I
Input Current
Current (V
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (T
DC Electrical Characteristics
T
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψ
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V
August 2007
Symbol
V
I
R
V
V
V
V
V
V
V
A
CC
CC
IH
IL
IN
DIFF_IN
IN_FSI
REF-AC
T_IN
DIFF_IN
= –40°C to +85°C, unless otherwise stated.
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
values are determined for a 4-layer board in still-air number, unless otherwise stated.
Source or Sink Current on (IN, /IN) ............... ±50mA
Source or sink current on V
IN
(max) is specified when V
REF
Parameter
Power Supply Voltage Range
Power Supply Current
Differential Input Resistance
(IN-to-/IN)
Input HIGH Voltage
(IN, /IN)
Input LOW Voltage
(IN, /IN)
Input Voltage Swing
(IN, /IN)
Differential Input Voltage Swing
(|IN - /IN|)
Input Voltage Threshold that
Triggers FSI
Output Reference Voltage
Voltage from Input to V
)
IN
) ............................ –0.5V to V
CC
) ............................... –0.5V to +4.0V
OUT
s
) .................... –65°C to +150°C
T
) .................................. ±10mA
is floating.
REF-AC
T
(4)
(1)
.............. ±1.5mA
(5)
Condition
No load, max. V
IN, /IN
IN, /IN
see Figure 3a, Note 6
see Figure 3b
CC
+0.3V
CC
3
Operating Ratings
Supply Voltage (V
Ambient Temperature (T
Package Thermal Resistance
DFN
Still-air (θ
Junction-to-board (ψ
JA
[e-mail]
IN
) ............................................ 93°C/W
V
2.375
) ...................... +2.375V to +2.625V
CC
Min
1.2
0.1
0.2
90
0
–1.3
A
(2)
) ................... –40°C to +85°C
JB
V
) .......................... 56°C/W
(3)
CC
Typ
100
2.5
35
30
–1.2
or [phone]
M9999-082907-B
V
V
2.625
CC
Max
IH
1.28
110
V
100
1.7
50
–0.1
CC
–1.1
SY58605U
JB
and θ
Units
mA
mV
Ω
V
V
V
V
V
V
V
JA