IP4051CX11/LF,135 NXP Semiconductors, IP4051CX11/LF,135 Datasheet - Page 34

• Manufacturer Part Number: IP4051CX11/LF,135
• Description: IC EMI FILTER MMC ESD PROT 11CSP
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of IP4051CX11/LF,135

• Capacitance: 25pF
• Package / Case: 11-CSP
• Resistance (ohms): 47, 13K, 56K
• Resistance In Ohms: 47, 13K, 56K
• Channels: 4 Channels
• Termination Style: SMD/SMT
• Tolerance: -
• Power (watts): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: /T3 934057926135 IP4051CX11/LF

NXP Semiconductors
6. Conclusion
AN10911_1
Application note
NXP Semiconductors offers a comprehensive portfolio of SD-memory card and MMC
compatible interface conditioning and protection devices.
This includes EMI filtering, system level ESD protection and biasing devices as well as
level translators including also the memory card supply LDO.
As shown before, the devices are optimized for compliance with their respective memory
card interface in terms of channel capacitance, serial resistance and biasing resistor
values.
The passive devices explained in this document protect from destruction from system
level ESD and also prevent disturbance of e.g. wireless interfaces from the harmonics of
the digital memory interfaces while the integrated biasing resistors contribute to gain the
maximum space savings compared to discrete solutions.
Furthermore, the active devices support level translations, ESD protection, EMI filtering
and power supply via an LDO (IP4853CX24 and IP4852CX25) to allow customers the
integration of SD-memory cards in 1.8 V level operating systems.
All devices presented support a simple PCB layout, reduce the risk of EMI due to complex
layout of scattered discrete components and allow to minimize compliance testing.
The high integration level and the final test of each device before shipment also improve
the overall quality, as the Integrated Discretes' components reduce the number of
individual components, solder joints and pick and places processes.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 29 April 2010
SD(HC)-memory card and MMC interface conditioning
AN10911
© NXP B.V. 2010. All rights reserved.
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