HMMC-1002 Avago Technologies US Inc., HMMC-1002 Datasheet - Page 4

• Manufacturer Part Number: HMMC-1002
• Manufacturer: Avago Technologies US Inc.

Specifications of HMMC-1002

• Operating Temperature (max): 125C
• Lead Free Status / RoHS Status: Compliant

4
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DC
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127 ± 15 µm.
Figure 2. HMMC-1002 Bonding Pad Locations.
Figure 3. HMMC-1002 Assembly Diagram.
610
233
in
0.7 mil dia. Gold Bond Wire
, V1, DC
(Length NOT important)
0
4 Wire Bonds using
0
out
, and V
RF
RF
IN
IN
2
bonding pads are 75 x 75 microns.
DC
IN
TC721A
V
1
476
nom. gap
2.0 mil
584
DC
OUT
V
887
2
994
RF
OUT
1410
OUT
RF
1470
233