LTM9005IV-AB#PBF Linear Technology, LTM9005IV-AB#PBF Datasheet - Page 23

• Manufacturer Part Number: LTM9005IV-AB#PBF
• Manufacturer: Linear Technology

Specifications of LTM9005IV-AB#PBF

• Lead Free Status / RoHS Status: Compliant

package DescripTion
CORNER
PAD 1
10.1600
10.1600
4
8.8900
7.6200
6.3500
5.0800
3.8100
2.5400
1.2700
0.0000
1.2700
2.5400
3.8100
5.0800
6.3500
7.6200
8.8900
aaa Z
SUGGESTED PCB LAYOUT
PACKAGE TOP VIEW
TOP VIEW
BSC
15
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
X
BSC
22
Y
204-Lead (22mm × 15mm × 4.32mm)
(Reference LTC DWG # 05-08-1841 Rev Ø)
aaa Z
0.635 ±0.025 SQ. 204x
3.95 – 4.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
4
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 204
SYMBOL
aaa
bbb
eee
LAND DESIGNATION PER JESD MO-222
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
DETAIL B
MOLD
TOLERANCE
CAP
eee
0.15
0.10
0.05
LGA Package
S
X
SUBSTRATE
Y
0.27 – 0.37
4.22 – 4.42
DETAIL B
0.12 – 0.28
SEE NOTES
3
20.32
BSC
PADS
1.27
BSC
COMPONENT
TRAY PIN 1
PIN “A1”
BEVEL
M
L
K
J
PACKAGE IN TRAY LOADING ORIENTATION
PACKAGE BOTTOM VIEW
H
LTMXXXXXX
µModule
G
13.97
BSC
F
LTM9005
E
D
C
LGA 204 0209 REV Ø
DETAIL A
B
23
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
9005p
Ø(0.635)
PAD 1