UJA1065TW/3V3 NXP Semiconductors, UJA1065TW/3V3 Datasheet - Page 70
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UJA1065TW/3V3
Manufacturer Part Number
UJA1065TW/3V3
Description
Network Controller & Processor ICs HI SPEED CAN SYSTEM
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065TW3V3.pdf
(76 pages)
Specifications of UJA1065TW/3V3
Number Of Transceivers
1
Power Down Mode
Standby
Operating Supply Voltage (min)
5.5V
Supply Current
10mA
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Product
Controller Area Network (CAN)
Data Rate
20 Kbps
Supply Voltage (max)
27 V, 52 V
Supply Voltage (min)
5.5 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
HTSSOP EP
Lead Free Status / RoHS Status
Compliant
Other names
UJA1065TW/3V3,512
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UJA1065TW/3V3
Manufacturer:
NXP
Quantity:
4 798
Part Number:
UJA1065TW/3V3
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
NXP Semiconductors
UJA1065_7
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
Rev. 07 — 25 February 2010
30.
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
High-speed CAN/LIN fail-safe system basis chip
3
3
)
)
Figure
350 to 2000
260
250
245
30) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
UJA1065
© NXP B.V. 2010. All rights reserved.
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