TS8388BMFS9NB1 E2V, TS8388BMFS9NB1 Datasheet - Page 7

• Manufacturer Part Number: TS8388BMFS9NB1
• Manufacturer: E2V

Specifications of TS8388BMFS9NB1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

1.3
TSEV8388B - Evaluation Board User Guide
Board
Mechanical
Characteristics
The board layer’s number, thickness, and functions are given below, from top to bottom.
Table 1-1. Board Layers Thickness Profile
The TSEV8388B is a seven-layer PCB constituted by four copper layers and three
dielectric layers.
The four metal layers correspond respectively from top to bottom to the AC and DC sig-
nals layer (layer 1), two ground layers (layers 3 and 5), and one supply layer (layer 7).
The upper inner ground plane (layer 3) constitutes the reference plane for the 50Ω
impedance signal traces. The lower inner ground plane (layer 5) is used for dielectric
substrate rigidity and is a replica of the upper ground plane.
The backside metal layer is dedicated to the power supplies planes, surrounded by a
ground plane.
The three dielectric layers are respectively (from top to bottom) constituted by a low
insertion loss dielectric layer (RO4003) (layer 2) and two parallel BT/Epoxy dielectric
layers (layers 4 and 6).
Considering the severe mechanical constraints due to the wide temperature range and
the high frequency domain in which the board is to operate, it is necessary to use a
sandwich of two different dielectric materials, with specific characteristics:
Layer
Layer 1
Copper layer
Layer 2
RO4003 dielectric layer
(Hydrocarbon/Wovenglass)
Layer 3
Copper layer
Layer 4
BT/Epoxy dielectric layer
Layer 5
Copper layer
Layer 6
BT/Epoxy dielectric layer
Layer 7
Copper layer
A low insertion loss RO4003 Hydrocarbon/wovenglass dielectric layer of 200 µm
thickness, chosen for its low loss (–0.318 dB/inch) and enhanced dielectric
consistency in the high frequency domain. The RO4003 dielectric layer is dedicated to
the routing of the 50Ω impedance signal traces (the RO4003 typical dielectric
constant is 3.4 at 10 GHz). The RO4003 dielectric layer characteristics are very close
to PTFE in terms of insertion loss characteristics.
A BT/Epoxy dielectric layer of 2 mm total thickness which is sandwiched between the
upper ground plane and the back-side supply layer.
Characteristics
Copper thickness = 35 µm
AC signals traces = 50Ω microstrip lines
DC signals traces (GORB, GAIN, DIODE)
Layer thickness = 200 µm
Dielectric constant = 3.4 at 10 GHz
–
–
Copper thickness = 35 µm
Upper ground plane = reference plane 50Ω microstrip return
Layer thickness = 630 µm
Copper thickness = 35 µm
Lower ground plane (board mechanical rigidity)
Layer thickness = 630 µm
Copper thickness = 35 µm
Power planes = V
0.044 dB/inch insertion loss at 2.5 GHz
0.318 dB/inch insertion loss at 18 GHz
EEA
, V
EED
, V
EET
, V
DD
, V
CC
, V
PLUSD
0973D–BDC–02/09
ground plane
Overview
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