5962-9098501MRA E2V, 5962-9098501MRA Datasheet - Page 16

no-image

5962-9098501MRA

Manufacturer Part Number
5962-9098501MRA
Description
Manufacturer
E2V
Datasheet

Specifications of 5962-9098501MRA

Lead Free Status / RoHS Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
5962-9098501MRA
Quantity:
86
DSCC FORM 2234
APR 97
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall
be in accordance with MIL-PRF-38535, appendix A.
conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4. VERIFICATION
4.1 Sampling and inspection. For device classes B, S, Q, and V, sampling and inspection procedures shall be in accordance
4.2 Screening. For device classes B, S, Q, and V, screening shall be in accordance with MIL-PRF-38535, and shall be
4.2.1 Additional criteria for device classes M, B, and S.
a.
DEFENSE SUPPLY CENTER COLUMBUS
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
(2) T
(3) Delete the sequence specified in 3.1.10 through 3.1.14 of method 5004 and substitute the first 7 test
(4) For device class M, unless otherwise noted, the requirements for device class B in method 1015 of MIL-STD-883
(5) Unless otherwise specified in the QM plan for static burn-in, device classes B and S, test condition A,
(6) Unless otherwise specified in the QM plan for dynamic burn-in, device classes B and S, test condition D, method
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
requirements of table IIA herein.
shall be followed.
method 1015 of MIL-STD-883, the test duration for each static test shall be 24 hours minimum for class S
devices and in accordance with table IA of method 1015 for class B devices.
1015 of MIL-STD-883, the following shall apply:
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
(a) For static burn-in I, all inputs shall be connected to GND. The output may be open or connected to
(b) For static burn-in II, all inputs shall be connected through the R1 resistors to V
(c) V
(a) Input resistors = 220 to 2 k ±20 percent.
(b) Output resistors = 220 ±20 percent.
(c) V
(d) The I
(e) CP1 = 25 kHz to 1 MHz square wave; frequency of CP2 = 1/2 frequency of CP1;
A
= +125C, minimum.
V
required when it is connected to V
or connected to V
when it is connected to V
connected through a resistor in series with V
resistors in parallel to clock pulse 1 (CP1). The Bn input pins shall be connected to the resistors in parallel
to clock pulse 2 (CP2).
duty cycle = 50 percent 15 percent; V
CC
CC
CC
STANDARD
/2 ±0.5 V. Resistors R1 are optional on inputs. A resistor R1 is optional on the output if it is open and
= 5.5 V +0.5 V, -0.00 V.
= 5.5 V +0.5 V, -0.00 V.
A=B
input pin shall be connected through a resistor in series with GND . The O
CC
/2 ±0.5 V. A resistor R1 is optional on the output if it is open and required on the output
CC
/2 ±0.5 V. R1 = 220 to 47 k.
CC
/2 ±0.5 V. R1 = 220 to 47 k.
IH
= 4.5 V to V
CC
nominal. The An input pins shall be connected to the
SIZE
A
CC
; V
IL
= 0.0 V 0.5 V; t
REVISION LEVEL
C
r
, t
CC
f
≤ 100 ns.
. The output may be open
A=B
output pin shall be
SHEET
5962-90985
16

Related parts for 5962-9098501MRA