5962-87664012A QP SEMICONDUCTOR, 5962-87664012A Datasheet - Page 4

• Manufacturer Part Number: 5962-87664012A
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-87664012A

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
Unless otherwise specified, the issues of these documents cited in the solicitation or contract.
2500 Wilson Boulevard, Arlington, VA 22201-3834).
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
revision level control and shall be made available to the preparing or acquiring activity upon request.
ELECTRONIC INDUSTRIES ALLIANCE (EIA)
(Copies of these documents are available online at http://www.jedec.org or from Electronic Industries Alliance,
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
MIL-STD-883
MIL-STD-1835 -
MIL-HDBK-103 -
MIL-HDBK-780 -
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
-
STANDARD
Interface Standard Electronic Component Case Outlines.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
List of Standard Microcircuit Drawings.
CMOS Devices.
SIZE
A
REVISION LEVEL
C
SHEET
5962-87664
4