UPD8862CY Renesas Electronics America, UPD8862CY Datasheet - Page 22

• Manufacturer Part Number: UPD8862CY
• Manufacturer: Renesas Electronics America

Specifications of UPD8862CY

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
20
Cautions 1.
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
µ
Partial heating method
PD8862CY : CCD linear image sensor 22-pin plastic DIP (10.16 mm (400))
2.
Process
During assembly care should be taken to prevent solder or flux from contacting the plastic
cap. The optical characteristics could be degraded by such contact.
Soldering by the solder flow method may have deleterious effects on prevention of plastic
cap soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 300 °C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S16033EJ3V0DS
Conditions
µ
PD8862