MPC860PVR80D4 Freescale, MPC860PVR80D4 Datasheet - Page 9
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MPC860PVR80D4
Manufacturer Part Number
MPC860PVR80D4
Description
Manufacturer
Freescale
Datasheet
1.MPC860PVR80D4.pdf
(80 pages)
Specifications of MPC860PVR80D4
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
80MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC860PVR80D4
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC860PVR80D4
Manufacturer:
VITESSE
Quantity:
5
Company:
Part Number:
MPC860PVR80D4
Manufacturer:
MOTOLOLA
Quantity:
852
Company:
Part Number:
MPC860PVR80D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC860PVR80D4
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MPC860PVR80D4R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Table 4
Freescale Semiconductor
1
2
3
4
5
6
Mold Compound Thickness
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
shows the thermal characteristics for the MPC860.
Rating
5
4
1
6
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
Natural convection
Airflow (200 ft/min)
Natural convection
Table 4. MPC860 Thermal Resistance Data
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
θJA
θJC
θJB
JT
2
3
3
3
MPC860P
0.85
ZP
34
22
27
18
14
6
2
Thermal Characteristics
MPC860P
ZQ / VR
1.15
34
22
27
18
13
8
2
•C/W
Unit
mm
C/W
9