MPC860PVR80D4 Freescale, MPC860PVR80D4 Datasheet - Page 75

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MPC860PVR80D4

Manufacturer Part Number
MPC860PVR80D4
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC860PVR80D4

Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
80MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Compliant

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Figure 78
Freescale Semiconductor
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
shows the mechanical dimensions of the ZQ PBGA package.
1.
2.
3.
4.
All Dimensions in millimeters.
Dimensions and tolerance per ASME Y14.5M, 1994.
Maximum Solder Ball Diameter measured parallel to Datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
NOTE
Mechanical Data and Ordering Information
75

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