LE3100MICH S L9PU Intel, LE3100MICH S L9PU Datasheet - Page 105

• Manufacturer Part Number: LE3100MICH S L9PU
• Manufacturer: Intel

Specifications of LE3100MICH S L9PU

• Family Name: Xeon Processor 3100
• Device Core Size: 64b
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.3625V
• Operating Supply Voltage (min): 0.85V
• Mounting: Surface Mount
• Pin Count: 1284
• Package Type: FCBGA3
• Lead Free Status / RoHS Status: Compliant

Debug Tools Specifications
8
8.1
8.1.1
8.1.2
Datasheet
Debug Tools Specifications
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging the processor systems. Tektronix and Agilent should be
contacted to get specific information about their logic analyzer interfaces. The following
information is general in nature. Specific information must be obtained from the logic
analyzer vendor.
Due to the complexity of Dual-Core Intel® Xeon® Processor 3100 Series systems, the
LAI is critical in providing the ability to probe and capture FSB signals. There are two
sets of considerations to keep in mind when designing a Dual-Core Intel® Xeon®
Processor 3100 Series system that can make use of an LAI: mechanical and electrical.
Mechanical Considerations
The LAI is installed between the processor socket and the processors. The LAI lands
plug into the processor socket, while the processors lands plug into a socket on the LAI.
Cabling that is part of the LAI egresses the system to allow an electrical connection
between the processors and a logic analyzer. The maximum volume occupied by the
LAI, known as the keepout volume, as well as the cable egress restrictions, should be
obtained from the logic analyzer vendor. System designers must make sure that the
keepout volume remains unobstructed inside the system. Note that it is possible that
the keepout volume reserved for the LAI may differ from the space normally occupied
by the processor heatsink. If this is the case, the logic analyzer vendor will provide a
cooling solution as part of the LAI.
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system
level simulations to prove that their tool will work in the system. Contact the logic
analyzer vendor for electrical specifications and load models for the LAI solution it
provides.
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