MC9S12DG128VPVE Freescale, MC9S12DG128VPVE Datasheet - Page 10

MC9S12DG128VPVE

Manufacturer Part Number
MC9S12DG128VPVE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12DG128VPVE

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
SCI/SPI/I2C/CAN
Total Internal Ram Size
8KB
# I/os (max)
91
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.25V
Operating Supply Voltage (min)
2.25/2.35/4.5V
On-chip Adc
2(8-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
128KB
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12DG128VPVE
Manufacturer:
FREESCALE
Quantity:
5 640
Part Number:
MC9S12DG128VPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12DG128VPVE
Manufacturer:
FREESCALE
Quantity:
5 640
Device User Guide — 9S12DT128DGV2/D V02.16
6.1.1
6.2
6.2.1
6.3
6.3.1
6.4
6.5
6.5.1
6.6
Section 7 Clock and Reset Generator (CRG) Block Description
7.1
Section 8 Oscillator (OSC) Block Description
8.1
Section 9 Enhanced Capture Timer (ECT) Block Description
Section 10 Analog to Digital Converter (ATD) Block Description
Section 11 Inter-IC Bus (IIC) Block Description
Section 12 Serial Communications Interface (SCI) Block Description
Section 13 Serial Peripheral Interface (SPI) Block Description
Section 14 J1850 (BDLC) Block Description
Section 15 Byteflight (BF) Block Description
15.1
Section 16 Pulse Width Modulator (PWM) Block Description
Section 17 Flash EEPROM 128K Block Description
Section 18 EEPROM 2K Block Description
Section 19 RAM Block Description
10
HCS12 Module Mapping Control (MMC) Block Description . . . . . . . . . . . . . . . . . . . 85
HCS12 Multiplexed External Bus Interface (MEBI) Block Description . . . . . . . . . . . 85
HCS12 Interrupt (INT) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
HCS12 Background Debug Module (BDM) Block Description . . . . . . . . . . . . . . . . . 86
HCS12 Breakpoint (BKP) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Freescale Semiconductor

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