XC56309AG100A Freescale, XC56309AG100A Datasheet - Page 77

• Manufacturer Part Number: XC56309AG100A
• Manufacturer: Freescale

Specifications of XC56309AG100A

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 102KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Compliant

Freescale Semiconductor
V
A15
A12
A11
NC
NC
NC
D4
D0
A9
A6
A4
A2
A0
CCD
14
Figure 3-5.
V
A16
A14
A10
AA0
CCQL
BG
D7
D5
D3
D2
13
A7
A5
A3
A1
V
V
V
V
V
AA1
A17
CCQH
A13
RD
D9
D8
D6
D1
A8
CCC
CCA
CCA
CCA
12
DSP56309 Molded Array Process-Ball Grid Array (MAP-BGA), Bottom View
V
GND
GND
GND
GND
GND
GND
GND
GND
D11
D10
WR
BR
BB
CCD
11
BCLK
BCLK
GND
GND
GND
GND
GND
GND
GND
GND
D14
D13
D12
TA
10
DSP56309 Technical Data, Rev. 7
V
V
V
GND
GND
GND
GND
GND
GND
GND
GND
OUT
CLK
D16
D15
CCQL
CCD
CCC
9
EXTAL
XTAL
GND
GND
GND
GND
GND
GND
GND
GND
CAS
D19
D17
D18
Bottom View
8
V
V
V
GND
GND
GND
GND
GND
GND
GND
GND
AA3
AA2
D20
CCQH
CCQL
CCD
7
GND
GND
V
GND
GND
GND
GND
GND
GND
GND
GND
D23
D21
D22
CCP
6
P1
P
MODB
MODD
MODC
RESET
PCAP
GND
GND
GND
GND
GND
GND
GND
GND
PB0
5
MODA
TRST
V
TDO
GND
GND
GND
GND
GND
GND
GND
GND
H2
H1
CCH
4
MAP-BGA Package Description
SRD0
SCK0
SC00
TIO2
TIO0
TMS
HDS
TCK
TXD
HA0
TDI
DE
H4
H3
3
V
HREQ
SC11
SC12
STD1
SC01
SC10
SCLK
V
HRW
TIO1
HA2
CCQL
H7
H5
CCS
2
V
HACK
SRD1
SCK1
SC02
PINIT
STD0
V
RXD
HCS
HA1
CCQH
NC
NC
H6
CCS
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
3-11