XC56309AG100A Freescale, XC56309AG100A Datasheet - Page 2

• Manufacturer Part Number: XC56309AG100A
• Manufacturer: Freescale

Specifications of XC56309AG100A

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 102KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Compliant

Table of Contents
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Appendix A
Data Sheet Conventions
ii
OVERBAR
“asserted”
“deasserted”
Examples:
Note: Values for
Signals/Connections
1.1
1.2
1.3
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
Specifications
2.1
2.3
2.4
2.5
Packaging
3.1
3.2
3.3
3.4
Design Considerations
4.1
4.2
4.3
4.4
4.5
Power Consumption Benchmark
Indicates a signal that is active when pulled low (For example, the
low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
V
Signal/Symbol
IL
,
Data Sheet Conventions .......................................................................................................................................ii
Features...............................................................................................................................................................iii
Target Applications ............................................................................................................................................. iv
Product Documentation ......................................................................................................................................iv
Power ................................................................................................................................................................1-3
Ground ..............................................................................................................................................................1-3
Clock.................................................................................................................................................................1-4
External Memory Expansion Port (Port A) ......................................................................................................1-4
Interrupt and Mode Control ..............................................................................................................................1-7
Host Interface (HI08)........................................................................................................................................1-8
Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-11
Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-12
Serial Communication Interface (SCI) ...........................................................................................................1-14
Timers .............................................................................................................................................................1-15
JTAG and OnCE Interface ..............................................................................................................................1-16
Maximum Ratings.............................................................................................................................................2-1
Thermal Characteristics ....................................................................................................................................2-2
DC Electrical Characteristics............................................................................................................................2-2
AC Electrical Characteristics............................................................................................................................2-3
TQFP Package Description...............................................................................................................................3-2
TQFP Package Mechanical Drawing................................................................................................................3-9
MAP-BGA Package Description ....................................................................................................................3-10
MAP-BGA Package Mechanical Drawing .....................................................................................................3-18
Thermal Design Considerations........................................................................................................................4-1
Electrical Design Considerations......................................................................................................................4-2
Power Consumption Considerations.................................................................................................................4-3
PLL Performance Issues ...................................................................................................................................4-4
Input (EXTAL) Jitter Requirements .................................................................................................................4-5
V
OL
PIN
PIN
PIN
PIN
,
V
IH
, and
V
OH
DSP56309 Technical Data, Rev. 7
are defined by individual product specifications.
True
False
True
False
Logic State
Asserted
Deasserted
Asserted
Deasserted
Signal State
RESET
Freescale Semiconductor
pin is active when
Voltage
V
V
V
V
IH
IH
IL
IL
/V
/V
/V
/V
OL
OH
OH
OL