CY8C5487LTI-007 Cypress Semiconductor Corp, CY8C5487LTI-007 Datasheet - Page 92

• Manufacturer Part Number: CY8C5487LTI-007
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY8C5487LTI-007

• Lead Free Status / RoHS Status: Compliant

13. Packaging
Table 13-1. Package Characteristics
Table 13-2. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Document Number: 001-55036 Rev. *F
Ta
Tj
Tja
Tja
Tjc
Tjc
Parameter
LASER MARK
PIN 1 DOT
Operating ambient temperature
Operating junction temperature
Package θ JA (68 QFN)
Package θ JA (100 TQFP)
Package θ JC (68 QFN)
Package θ JC (100 TQFP)
Pb-Free assemblies (20s to 40s) -
Sn-Ag-Cu solder paste reflow
temperature
Pb-Free assemblies (20s to 40s) -
Sn-Pb solder paste reflow temper-
ature
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
7
1
100-TQFP
Package
HATCH AREA IS SOLDERABLE EXPOSED METAL.
68-QFN
1
8
Figure 13-1. 68-Pin QFN 8x8 with 0.4 mm Pitch Package Outline (Sawn Version)
6
8
Description
8.000±0.100
TOP VIEW
PRELIMINARY
5
2
3
4
5
1
3
5
0.900±0.100
Conditions
SIDE VIEW
MSL 3
MSL 3
0.200 REF
0.05 MAX
MSL
PSoC
5.7±0.10
0.400±0.100
0.20±0.05
Min
235
205
®
-40
-40
5
1
3
5
-
-
-
-
5: CY8C54 Family Data
5
2
3
4
SOLDERABLE
10.93
29.50
EXPOSED
6.08
7.32
Typ
BOTTOM VIEW
25
-
-
-
6.40 REF
0.400 PITCH
PAD
5.7±0.10
Max
100
245
220
85
-
-
-
-
001-09618 *C
6
8
1
8
Page 92 of 97
°C/Watt
°C/Watt
°C/Watt
°C/Watt
1
7
1
Units
PIN1 ID
R 0.20
°C
°C
°C
°C
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