LH79524N0F100A1 NXP Semiconductors, LH79524N0F100A1 Datasheet - Page 42

• Manufacturer Part Number: LH79524N0F100A1
• Description: Microcontrollers (MCU) LCD USB ETH'NET MMU LFBGA208
• Manufacturer: NXP Semiconductors

Specifications of LH79524N0F100A1

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Applications: Embedded Control
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.7/3V
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.9/3.6V
• Package Type: LFBGA
• Screening Level: Industrial
• Pin Count: 208
• Mounting: Surface Mount
• Rad Hardened: No
• Data Bus Width: 32 bit
• Program Memory Type: ROMLess
• Data Ram Size: 16 KB
• Interface Type: I2C, I2S, IrDA, SSP, UART, USB
• Maximum Clock Frequency: 76.205 MHz
• Number Of Programmable I/os: 108
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: LFBGA
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Lead Free Status / RoHS Status: Compliant

LH79524/LH79525
SDRAM MEMORY CONTROLLER WAVEFORMS
SDRAM Burst Read (page already open). Figure 22
shows the waveform and timing for SDRAM to Activate
a Bank and Write.
42
Figure 21 shows the waveform and timing for an
NOTES:
1. SDRAMcmd is the combination of nRAS, nCAS, nSDWE, and nSDCS(X).
2. tOVXXX represents tOVRA, tOVCA, tOVSDW, or tOVSC.
3. tOHXXX represents tOHRA, tOHCA, tOHSDW, or tOHSC.
4. SDCKE is HIGH.
SDRAMcmd
D[31:0]
A[14:0]
DQMx
SCLK
t SDCLK
Figure 21. SDRAM Burst Read
Rev. 02 — 17 March 2009
NXP Semiconductors
t OVXXX
t OVDQ
READ
COLUMN
BANK,
t OHXXX
t OVA
LATENCY = 2
NOP
CAS
tISD tIHD
NOP
DATA n
NOP
t OHDQ
DATA n + 1
READ
DATA n + 2
NOP
DATA n + 3
NOP
Product data sheet
System-on-Chip
LH79525-3