VND920PTR-E STMicroelectronics, VND920PTR-E Datasheet - Page 20

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VND920PTR-E

Manufacturer Part Number
VND920PTR-E
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of VND920PTR-E

Lead Free Status / RoHS Status
Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
VND920PTR-E
Manufacturer:
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Package and PCB thermal data
4
4.1
Note:
Table 13.
20/26
Chip 1
OFF
ON
ON
ON
Chip 2
OFF
ON
ON
ON
Package and PCB thermal data
SO-28 thermal data
Figure 21. SO-28 PC board
Layout condition of R
thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.5 cm
Thermal calculation according to the PCB heatsink area
R
R
R
thA
thB
thC
R
R
R
(R
= Thermal resistance Junction to Ambient with both chips ON and P
= Thermal resistance Junction to Ambient with one chip ON
= Mutual thermal resistance
thA
thC
thB
thA
x P
x (P
x P
x P
dchip1
dchip2
dchip1
dchip1
+ T
+ T
) + R
+ P
T
amb
amb
jchip1
dchip2
th
thC
and Z
x P
) + T
dchip2
th
amb
Doc ID 10898 Rev 4
measurements (PCB FR4 area= 58 mm x 58 mm, PCB
+ T
amb
R
R
R
(R
thC
thA
thB
thA
x P
x (P
x P
x P
dchip2
dchip1
dchip2
dchip1
+ T
) + R
+ T
+ P
T
jchip2
amb
amb
dchip2
thC
2
x P
, 3 cm
) + T
dchip1
amb
2
, 6 cm
+ T
amb
dchip1
2
).
P
P
dchip1
dchip1
=P
VND920P-E
dchip2
Note
=P
≠P
dchip2
dchip2

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