HCPL-0708-500 Avago Technologies US Inc., HCPL-0708-500 Datasheet - Page 5

HCPL-0708-500

Manufacturer Part Number
HCPL-0708-500
Description
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-0708-500

Number Of Elements
1
Input Type
DC
Forward Voltage
1.8V
Forward Current
20mA
Output Current
2mA
Package Type
SOIC
Operating Temp Range
-40C to 100C
Propagation Delay Time
60ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Output Type
Push-Pull
Isolation Voltage
3750Vrms
Lead Free Status / RoHS Status
Not Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-0708-500E
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-0708-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Insulation and Safety Related Specifications
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along

Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(I01)
L(I02)
CTI
Value
4.9
4.8
0.08
≥175
IIIa
Units
mm
mm
mm
Volts
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)

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