HCPL-0708-500 Avago Technologies US Inc., HCPL-0708-500 Datasheet - Page 4

• Manufacturer Part Number: HCPL-0708-500
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0708-500

• Number Of Elements: 1
• Input Type: DC
• Forward Voltage: 1.8V
• Forward Current: 20mA
• Output Current: 2mA
• Package Type: SOIC
• Operating Temp Range: -40C to 100C
• Propagation Delay Time: 60ns
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Output Type: Push-Pull
• Isolation Voltage: 3750Vrms
• Lead Free Status / RoHS Status: Not Compliant

Solder Reflow Thermal Profile
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-0708 has been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01 (Option 060 only)

TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
ROOM
smax
smin
T
T
25
p
L
= 200 °C, T
150 - 200 °C
217 °C
300
200
100
0
0
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
RAMP-UP
= 150 °C
t
s
260 +0/-5 °C
TIME
50
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
t
t
L
p
2.5°C ± 0.5°C/SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
100
RAMP-DOWN
6 °C/SEC. MAX.
TIME (SECONDS)
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250