MR4A16BMA35 EverSpin Technologies Inc, MR4A16BMA35 Datasheet - Page 13

• Manufacturer Part Number: MR4A16BMA35
• Manufacturer: EverSpin Technologies Inc

Specifications of MR4A16BMA35

• Word Size: 16b
• Density: 16Mb
• Interface Type: Parallel
• Access Time (max): 35ns
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 70C
• Pin Count: 48
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Everspin Technologies © 2010
5. MECHANICAL DRAWING
(DATUM A)
bbb
ddd
Ref
Ref
eee
aaa
D1
DE
A1
E1
SE
fff
A
D
b
E
e
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION.
THE PRE-REFLOW DIAMETER IS
(DATUM B)
BOTTOM VIEW
1.19
0.22
Min
0.31
Tolerance of, from and position
6
5
4
3
2
1
Nominal
10.00 BSC
10.00 BSC
0.375 BSC
0.375 BSC
5.25 BSC
3.75 BSC
0.75 BSC
1.27
0.27
0.36
0.10
0.10
0.12
0.15
0.08
ø
0.35mm
A
B
C
D
E
F
G
H
PIN A1
INDEX
Figure 5.1 48-FBGA
Max
1.35
0.32
0.41
SEATING PLANE
13
1. Dimensions in Millimeters.
2. The ‘e’ represents the basic solder ball grid pitch.
3. ‘b’ is measurable at the maximum solder ball diameter
4. Dimension ‘ccc’ is measured parallel to primary datum
5. Primary datum C (seating plane) is defined by the
6. Package dimensions refer to JEDEC MO-205 Rev. G.
Document Number: MR4A16B Rev. 5, 4/2010
in a plane parallel to datum C.
C.
crowns
of the solder balls.
Print Version Not To Scale
BOTTOM VIEW
PIN A1
INDEX
MR4A16B