K4H511638C-UCB3 Samsung Semiconductor, K4H511638C-UCB3 Datasheet - Page 17

• Manufacturer Part Number: K4H511638C-UCB3
• Manufacturer: Samsung Semiconductor
• Type: DDR SDRAMr

Specifications of K4H511638C-UCB3

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 185mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

The following specification parameters are required in systems using DDR333, DDR266 & DDR200 devices to ensure proper system
performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
20.0 System Characteristics for DDR SDRAM
DDR SDRAM 512Mb C-die (x4, x8, x16)
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
Slew Rate Characteristic
Slew Rate Characteristic
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
TBD
MIN
DDR266B
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
TBD
TBD
MIN
(V/ns)
(V/ns)
4.5
4.5
5.0
5.0
DDR333
Notes
Notes
Notes
0.67
MIN
MAX
TBD
k
k
k
i
i
i
j
j
j
DDR200
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
TBD
1.5
MIN
DDR266
MAX
TBD
Notes
e, l
Rev. 1.2 January 2007
MIN
0.5
DDR200
MAX
4.0
DDR SDRAM
Units
V/ns
Notes
a, l