K4D263238KVC50 Samsung Semiconductor, K4D263238KVC50 Datasheet - Page 4
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K4D263238KVC50
Manufacturer Part Number
K4D263238KVC50
Description
Manufacturer
Samsung Semiconductor
Type
FPMr
Datasheet
1.K4D263238KVC50.pdf
(19 pages)
Specifications of K4D263238KVC50
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
700ps
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.625V
Operating Supply Voltage (min)
2.375V
Supply Current
60mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
K4D263238K
PIN CONFIGURATION
PIN DESCRIPTION
NOTE:
1. RFU1 is reserved for A12
2. RFU2 is reserved for BA2
3. VSS Thermal balls are optional
CK,CK
CKE
CS
RAS
CAS
WE
DQS
DM
RFU
M
B
C
D
E
G
H
K
N
F
J
L
DQS0
DQS2
DQ17
DQ19
DQ21
DQ22
DQ4
DQ6
DQ7
CAS
RAS
2
CS
VDDQ
VDDQ
DQ16
DQ18
DQ20
DQ23
DM0
DQ5
DM2
WE
3
NC
NC
Data Strobe
Differential Clock Input
Clock Enable
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Data Mask
Reserved for Future Use
VDDQ
VDDQ
VDDQ
VDDQ
VSSQ
VSSQ
VDD
VDD
BA0
4
NC
NC
NC
(Top View)
VDDQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
DQ3
VSS
VSS
BA1
5
A0
Thermal
Thermal
Thermal
Thermal
VSSQ
VSSQ
DQ2
DQ1
VSS
VSS
VSS
VSS
VSS
A10
6
A2
A1
Thermal
Thermal
Thermal
Thermal
VDDQ
VDD
VDD
DQ0
VSS
VSS
VSS
VSS
VSS
VSS
A11
7
A3
- 4/19 -
BA
A
DQ
V
V
V
V
NC
0
DD
SS
DDQ
SSQ
Thermal
Thermal
Thermal
Thermal
VDDQ
DQ31
0
~A
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
0
8
, BA
A9
A4
~ DQ
11
1
31
Thermal
Thermal
Thermal
Thermal
VSSQ
VSSQ
DQ29
DQ30
RFU
VSS
VSS
VSS
VSS
VSS
9
A5
A6
1
VDDQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
DQ28
RFU
10
VSS
VSS
128M GDDR SDRAM
A7
2
Bank Select Address
Data Input/Output
Power
Ground
Power for DQ
Ground for DQ
No Connection
Address Input
Rev. 1.2 October 2007
VDDQ
VDDQ
VDDQ
VDDQ
A8/AP
VSSQ
VSSQ
11
VDD
VDD
NC
NC
CK
VDDQ
VDDQ
DQ26
DQ15
DQ13
DQ11
12
’
DM3
DM1
DQ9
CKE
s
NC
CK
’
s
DQS3
DQS1
VREF
DQ27
DQ25
DQ24
DQ14
DQ12
DQ10
13
DQ8
NC
NC