MT47H32M16HR-3 IT:F Micron Technology Inc, MT47H32M16HR-3 IT:F Datasheet - Page 23
MT47H32M16HR-3 IT:F
Manufacturer Part Number
MT47H32M16HR-3 IT:F
Description
MICMT47H32M16HR-3_IT:F 32MBX16 DDR2
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16HR-3_ITF.pdf
(132 pages)
Specifications of MT47H32M16HR-3 IT:F
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Table 7: Thermal Impedance (Continued)
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Die Revision
G
1
Package Substrate
60-ball
84-ball
Note:
2-layer
4-layer
2-layer
4-layer
1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
Airflow = 0m/s
Θ JA (°C/W)
94.2
76.4
88.8
71.4
Airflow = 1m/s
Electrical Specifications – Absolute Ratings
23
Θ JA (°C/W)
76.5
66.9
71.3
62.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
Airflow = 2m/s Θ JB (°C/W) Θ JC (°C/W)
Θ JA (°C/W)
70.1
63.1
65.6
58.7
© 2004 Micron Technology, Inc. All rights reserved.
57.3
56.5
52.5
52.0
6.1
6.0
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