MT48LC8M16A2P-7E:G Micron Technology Inc, MT48LC8M16A2P-7E:G Datasheet - Page 73

IC, SDRAM 128MB, SMD, 48LC8, TSOP54

MT48LC8M16A2P-7E:G

Manufacturer Part Number
MT48LC8M16A2P-7E:G
Description
IC, SDRAM 128MB, SMD, 48LC8, TSOP54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheet

Specifications of MT48LC8M16A2P-7E:G

Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
165mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Package / Case
TSOP
Memory Type
SDRAM
Memory Configuration
4 BLK (2M X 16)
Interface Type
LVTTL
Rohs Compliant
Yes
Format - Memory
RAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
ANPEC
Quantity:
34 000
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MT
Quantity:
1 000
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MICRON-Pb free
Quantity:
1
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MICRON
Quantity:
20 000
Figure 57:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60-Ball FBGA “FB/BB” Package (x8 device), 8mm x 16mm
60X Ø 0.45
8.00 ±0.05
Notes:
5.60
BALL
A8
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
0.155 ±0.013
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
73
SEATING PLANE
0.10 A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID

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