S71WS512ND0BFWEP0 Spansion Inc., S71WS512ND0BFWEP0 Datasheet - Page 10
S71WS512ND0BFWEP0
Manufacturer Part Number
S71WS512ND0BFWEP0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71WS512ND0BFWEP0.pdf
(13 pages)
Specifications of S71WS512ND0BFWEP0
Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
8
5.3.2
FTA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.4 mm
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
φb
eE
eD
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
B1,B10,C1,C10,D1,D10,E1,E10
M2,M3,M4,M5,M6,M7,M8,M9
0.17
1.02
0.35
84X
MIN
---
A2,A3,A4,A5,A6,A7,A8,A9
F1,F10,G1,G10,H1,H10
J1,J10,K1,K10,L1,L10
11.60 mm x 8.00 mm
0.15 M C
0.08
INDEX MARK
6
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
b
FTA 084
M C
NOM
0.40
N/A
10
---
---
---
12
10
84
A B
SIDE VIEW
TOP VIEW
MAX
1.40
1.17
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71WS-N
NOTE
D a t a
C
0.15
A
(2X)
E
B
C
0.20 C
0.08
S h e e t
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
eD
10
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
7
J
BOTTOM VIEW
H
G
D1
S71WS-N_00_A7 April 4, 2008
F
E
D C
B
A
SE
CORNER
PIN A1
3388 \ 16-038.21a
7
E1