S71WS512ND0BFWEP0 Spansion Inc., S71WS512ND0BFWEP0 Datasheet

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S71WS512ND0BFWEP0

Manufacturer Part Number
S71WS512ND0BFWEP0
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of S71WS512ND0BFWEP0

Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Publication Number S71WS-N_00
Notice On Data Sheet Designations
Revision A
Amendment 7
for definitions.
Issue Date April 4, 2008
S71WS-N Cover Sheet

Related parts for S71WS512ND0BFWEP0

S71WS512ND0BFWEP0 Summary of contents

Page 1

S71WS-N Stacked Multi-Chip Product (MCP) 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with CellularRAM Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as ...

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... Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” ...

Page 3

S71WS-N Stacked Multi-Chip Product (MCP) 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with CellularRAM Data Sheet Features Power supply voltage of 1 1.95 V Burst Speed: 54 MHz, 66 MHz, 80 MHz General Description The S71WS-N Series is ...

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Product Selector Guide Device Numbers S71WS128NB0 S71WS128NC0 S71WS256NC0 S71WS256ND0 S71WS512NC0 S71WS512ND0 Note: 0 (Protected), 1 (Unprotected [Default State pSRAM pSRAM Flash Speed Model Density Speed Flash (Mb) (MHz) (MHz) ...

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Ordering Information The order number is formed by a valid combinations of the following: S71WS 256 N C 2.1 Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office ...

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Input/Output Descriptions Table 3.1 identifies the input and output package connections provided on the device. Symbol A23-A0 Address inputs DQ15-DQ0 Data input/output OE# Output Enable input. Asynchronous relative to CLK for the Burst mode. WE# Write Enable input. V ...

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MCP Block Diagram F-VCC Flash-only Address Shared Address CLK WP# ACC F1-CE# (Note 2) OE# WE# F-RST# AVD# F2-CE# (Note 2) R-VCC R-CE1# R-UB# R-LB# R-CE2 (Note 1) R-CRE Notes: 1. R-CRE is only present in CellularRAM-compatible pSRAM. 2. ...

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Connection Diagrams 5.2.1 CellularRAM Based Pinout A1 DNU B2 AVD# C2 F-WP F1-CE# J2 R-CE1# K2 RFU L2 RFU M1 DNU Notes MCPs based on a single S29WS256N ...

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Look-Ahead Pinout for Future Designs Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note (publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for more details. 5.3 Physical Dimensions 5.3.1 TLA084—84-ball Fine-Pitch Ball Grid Array ...

Page 10

FTA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.4 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0. 0. PACKAGE FTA 084 JEDEC N/A D ...

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TSD084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.2 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0. 0. PACKAGE TSD 084 JEDEC N ...

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FEA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.4 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0.15 M 0.08 M PACKAGE FEA 084 JEDEC N ...

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... Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2004-2008 Spansion Inc. All rights reserved. Spansion ™ ™ ...

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