M36W0R6040T0ZAQ STMicroelectronics, M36W0R6040T0ZAQ Datasheet

no-image

M36W0R6040T0ZAQ

Manufacturer Part Number
M36W0R6040T0ZAQ
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of M36W0R6040T0ZAQ

Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M36W0R6040T0ZAQ
Manufacturer:
ST
0
Part Number:
M36W0R6040T0ZAQ
Manufacturer:
ST
Quantity:
20 000
Part Number:
M36W0R6040T0ZAQT
Manufacturer:
ST
0
FEATURES SUMMARY
FLASH MEMORY
December 2004
MULTI-CHIP PACKAGE
SUPPLY VOLTAGE
LOW POWER CONSUMPTION
ELECTRONIC SIGNATURE
PACKAGES
PROGRAMMING TIME
MEMORY BLOCKS
SYNCHRONOUS / ASYNCHRONOUS READ
DUAL OPERATIONS
1 die of 64 Mbit (4Mb x 16) Flash Memory
1 die of 16 Mbit (1Mb x 16) Pseudo SRAM
V
Manufacturer Code: 20h
Device Code (Top Flash Configuration),
M36W0R6040T0: 8810h
Device Code (Bottom Flash
Configuration), M36W0R6040B0: 8811h
Compliant with Lead-Free Soldering
Processes
Lead-Free Versions
8µs by Word typical for Fast Factory
Program
Double/Quadruple Word Program option
Enhanced Factory Program options
Multiple Bank Memory Array: 4 Mbit
Banks
Parameter Blocks (Top location)
Synchronous Burst Read mode: 66MHz
Asynchronous/ Synchronous Page Read
mode
Random Access: 70ns
Program Erase in one Bank while Read in
others
No delay between Read and Write
operations
DDF
= V
64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory
DDP
and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package
= V
DDQ
= 1.7V to 1.95V
Figure 1. Package
PSRAM
BLOCK LOCKING
SECURITY
COMMON FLASH INTERFACE (CFI)
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ACCESS TIME: 70ns
LOW STANDBY CURRENT: 110µA
DEEP POWER DOWN CURRENT: 10µA
All blocks locked at Power-up
Any combination of blocks can be locked
WP
128-bit user programmable OTP cells
64-bit unique device number
F
for Block Lock-Down
Stacked TFBGA88 (ZA)
M36W0R6040B0
M36W0R6040T0
8 x 10mm
FBGA
1/18

Related parts for M36W0R6040T0ZAQ

M36W0R6040T0ZAQ Summary of contents

Page 1

Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 16 Mbit (1Mb x ...

Page 2

M36W0R6040T0, M36W0R6040B0 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

DC AND AC PARAMETERS ...

Page 4

M36W0R6040T0, M36W0R6040B0 SUMMARY DESCRIPTION The M36W0R6040T0 and M36W0R6040B0 are Multiple Memory Products which combine two memory devices; a 64-Mbit, Multiple Bank Flash memories, the M58WR064FT/B, and a 16-Mbit Pseudo SRAM, the M69AR024B. Recommended operating conditions do not allow more than ...

Page 5

Figure 3. TFBGA Connections (Top view through package ...

Page 6

M36W0R6040T0, M36W0R6040B0 SIGNAL DESCRIPTIONS See Figure 2., Logic Diagram Names, for a brief overview of the signals connect this device. Address Inputs (A0-A19). Addresses are common inputs for the Flash Memory and PSRAM components. The Address Inputs select ...

Page 7

PSRAM Output Enable (G ). The Output En- P able provides a high speed tri-state control, P allowing fast read/write cycles to be achieved with the common I/O data bus. PSRAM Write Enable (W ). The Write Enable, ...

Page 8

M36W0R6040T0, M36W0R6040B0 FUNCTIONAL DESCRIPTION The Flash Memory and PSRAM components have separate power supplies but share the same grounds. They are distinguished by three Chip En- able inputs: E for the Flash memory and for the PSRAM. ...

Page 9

Table 2. Main Operating Modes Operation Flash Read Flash Write Flash Address Latch Flash Output ...

Page 10

M36W0R6040T0, M36W0R6040B0 FLASH MEMORY DEVICE The M36W0R6040T0 and M36W0R6040B0 con- tain a 64Mbit Flash memory. For detailed informa- tion on how to use it, see the M58WR064F(T/B) PSRAM DEVICE The M36W0R6040T0 and M36W0R6040B0 con- tain a 16Mbit PSRAM. For detailed ...

Page 11

... Note: 1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn- assembly), the ST ECOPACK and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU. plied. Exposure to Absolute Maximum Rating con- ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu- ments. Parameter ...

Page 12

M36W0R6040T0, M36W0R6040B0 DC AND AC PARAMETERS This section summarizes the operating measure- ment conditions, and the DC and AC characteris- tics of the device. The parameters in the DC and AC characteristics Tables that follow, are derived from tests performed ...

Page 13

Table 6. Flash Memory DC Characteristics - Currents Symbol Parameter I Input Leakage Current LI I Output Leakage Current LO Supply Current Asynchronous Read (f=6MHz) Supply Current Synchronous Read (f=54MHz) I DD1 Supply Current Synchronous Read (f=66MHz) I Supply Current ...

Page 14

M36W0R6040T0, M36W0R6040B0 Table 7. Flash Memory DC Characteristics - Voltages Symbol Parameter V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage Program Voltage-Logic PP1 PPF V V ...

Page 15

PACKAGE MECHANICAL Figure 7. Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch, Package Outline BALL "A1" FE Note: Drawing is not to scale. Table 9. Stacked TFBGA88 8x10mm - 8x10 ball array, 0.8mm pitch, Package ...

Page 16

M36W0R6040T0, M36W0R6040B0 PART NUMBERING Table 10. Ordering Information Scheme Example: Device Type M36 = Multiple Memory Product (Multiple Flash + RAM) Flash 1 Architecture W = Multiple Bank, Burst mode Flash 2 Architecture 0 = none present Operating Voltage R ...

Page 17

REVISION HISTORY Table 11. Document Revision History Date Version 07-Nov-2003 1.0 First Issue Document status promoted from Target Specification to full Datasheet. Package specification updated. The TFBGA88 package is fully compliant with the ST ECOPACK specification. 02-Dec-2004 2.0 Flash memory ...

Page 18

... No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics ...

Related keywords