RD38F2020W0YBQ0 SB93 Micron Technology Inc, RD38F2020W0YBQ0 SB93 Datasheet - Page 54

• Manufacturer Part Number: RD38F2020W0YBQ0 SB93
• Manufacturer: Micron Technology Inc

Specifications of RD38F2020W0YBQ0 SB93

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Table 28: Parameter / Mux Configuration Decoder
1. Only Flash is Muxed and RAM is non-Muxed
2. Both Flash and RAM are AD-Muxed
Table 29: Ballout Decoder
Datasheet
54
T = Non Mux
U = AD Mux
W = "Full" Ad
Mux
0 (Zero)
B
C
Q
U
V
W
Identification
Code, Mux
Code
Number of Flash Die
1
2
3
4
2
4
SDiscrete ballout (Easay BGA and TSOP)
x16D ballout, 105 ball (x16 NOR + NAND + DRAM Share Bus)
x16C ballout, 107 ball (x16 NOR + NAND + PSRAM Share Bus)
QUAD/+ ballout, 88 ball (x16 NOR + PSRAM Share Bus)
x32SH ballout, 106 ball (x32 NOR only Share Bus)
x16SB ballout, 165 ball (x16 NOR / NAND + x16 DRAM Split Bus
x48D ballout, 165 ball (x16/x32 NOR + NAND + DRAM Split Bus
X16
X32
Bus Width
Top
Top
Top
Top
Top
Top
Ballout Definition
Flash Die 1
128-Mbit W18 Family with Synchronous PSRAM
-
Bottom
Top
Bottom
Top
Top
Flash Die 2
-
-
Bottom
Top
-
Bottom
Flash Die 3
Order Number: 311760-10
November 2007
-
-
-
Bottom
-
Bottom
Flash Die 4