AD9852ASQ Analog Devices Inc, AD9852ASQ Datasheet - Page 42

• Manufacturer Part Number: AD9852ASQ
• Manufacturer: Analog Devices Inc

Specifications of AD9852ASQ

• Lead Free Status / RoHS Status: Not Compliant

AD9852
The thermal land itself must be able to distribute heat to an
even larger copper plane, such as an internal ground plane.
Vias must be uniformly provided over the entire thermal pad to
connect to this internal plane. A proposed via pattern is shown
in Figure 63. Via holes should be small (12 mil, 0.3 mm), so
they can be plated and plugged. These provide the mechanical
conduit for heat transfer.
Figure 63. Proposed Via Pattern
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Finally, a proposed stencil design is shown in Figure 64 for
screen solder placement. If vias are not plugged, wicking occurs,
which displaces solders away from the exposed heat sink, and
the necessary mechanical bond is not established.
Figure 64. Proposed Solder Placement